| Brand | Infinix |
| Model | Smart 3 Dual SIM TD-LTE APAC X5516B |
| Released | 2019 May |
| Hardware Designer | Infinix Mobility |
| General Extras | Haptic touch feedback |
| Device Category | Smartphone |
| Width | 71 mm |
| Height | 141 mm |
| Depth | 8.4 mm |
| Dimensions | 2.80×5.55×0.33 inches |
| Mass | 159 g |
| Platform | Android |
| Operating System | Google Android 9 Pie Go edition (Pie) |
| Software Extras | Navigation software , Face Recognition |
| CPU Clock | 2000 MHz |
| CPU | MediaTek Helio A22 MT6761, 2018, 64 bit, quad-core, 12 nm, IMG PowerVR GE8300 GPU |
| RAM Type | LPDDR3 SDRAM |
| RAM Capacity (converted) | 1 GiB RAM |
| Non-volatile Memory Interface | eMMC 5.1 |
| Non-volatile Memory Capacity (converted) | 16 GB ROM |
| Display Diagonal | 139.7 mm |
| Resolution | 720×1440 |
| Horizontal Full Bezel Width | 8.52 mm |
| Display Area Utilization | 78.0% |
| Pixel Density | 293 PPI |
| Display Type | Color IPS TFT LCD display |
| Number of Display Scales | 16.8M |
| Scratch Resistant Screen | Yes |
| Graphical Controller | PowerVR GE8300 |
| A/V Out | No |
| Microphone(s) | mono |
| Loudspeaker(s): | mono |
| Audio Output: | 3.5mm |
| Supported Cellular Bands | GSM850 , GSM900 , GSM1800 , GSM1900 , UMTS2100 (B1) , UMTS850 (B5) , UMTS900 (B8) , LTE2100 (B1) , LTE1800 (B3) , LTE850 (B5) , LTE900 (B8) , TD-LTE2600 (B38) , TD-LTE2300 (B40) , TD-LTE2500 (B41) bands |
| Supported Cellular Data Links | GPRS , EDGE , UMTS , HSUPA , HSUPA 5.8 , HSDPA , HSDPA 7.2 , HSPA+ 21.1 , LTE , LTE 100/50 , LTE 150/50 data links |
| SIM Card Slot | Nano-SIM (4FF) |
| Complementary Phone Services | Voice transmission , Voice speaker , Vibrate , Speakerphone , ANC , HD Voice , VoLTE |
| Dual Cellular Network Operation | Dual standby |
| Sec. Supported Cellular Networks: | GSM850 , GSM900 , GSM1800 , GSM1900 , UMTS2100 (B1) , UMTS850 (B5) , UMTS900 (B8) , LTE2100 (B1) , LTE1800 (B3) , LTE850 (B5) , LTE900 (B8) , TD-LTE2600 (B38) , TD-LTE2300 (B40) , TD-LTE2500 (B41) |
| Sec. Supported Cellular Data Links: | GPRS , EDGE , UMTS , HSUPA , HSUPA 5.8 , HSDPA , HSDPA 7.2 , HSPA+ 21.1 , DC-HSDPA 42.2 , LTE , LTE 100/50 , LTE 150/50 |
| Sec. SIM Card Slot | Nano-SIM (4FF) |
| Touchscreen Type | Capacitive multi-touch screen |
| Expansion Interfaces | TransFlash , microSD , microSDHC , microSDXC |
| USB | USB 2.0 |
| USB Services | USB charging |
| USB Connector | USB Micro-B (Micro-USB) |
| Max. Charging Power | 6.0 W |
| Bluetooth | Bluetooth 4.1 |
| Wireless LAN | 802.11b , 802.11g , 802.11n |
| Wireless Services | Wi-Fi Tethering |
| FM Radio Receiver | FM radio (88-108 MHz) |
| Complementary Satellite Services | Simultaneous GPS , A-GPS , Geotagging , QuickGPS |
| Camera Placement | Rear |
| Camera Image Sensor | CMOS |
| Number of effective pixels | 13.2 MP camera |
| Zoom | 1.0 x optical zoom |
| Focus | PD AF |
| Video Recording | 1920×1080 pixel |
| Flash | dual LED |
| Camera Extra Functions | HDR photo , Macro mode , Panorama Photo , Face detection , Face retouch |
| Aux. Camera Image Sensor | No |
| Aux. 2 Camera Image Sensor | No |
| Aux. 3 Camera Image Sensor | No |
| Aux. 4 Camera Image Sensor | No |
| Secondary Camera Placement | Front |
| Secondary Camera Sensor | CMOS |
| Secondary Camera Number of pixels | 8.1 MP sec. cam |
| Secondary Video Recording | 1920×1080 pixel |
| Sec. Built-in Flash | single LED |
| Secondary Camera Extra Functions | Face detection , Face retouch |
| Sec. Aux. Cam. Image Sensor | CMOS |
| Built-in compass | Yes |
| Built-in accelerometer | Yes |
| Built-in gyroscope | Yes |
| Additional sensors | FP sensor , L sensor , P sensor |
| Protection from solid materials | Yes |
| Protection from liquids | Yes |
| Battery | Li-ion |
| Nominal Battery Capacity | 3500 mAh battery |
| Talk Time: | 9.6 hours |
| Market Countries | Bangladesh , India , Indonesia , Malaysia , Philippines , Thailand , Vietnam |
| Market Regions | Asia , Middle East , Oceania , Southeast Asia |
| Added | 2024-06-14 |
Specifications data description of this 📱Infinix Smart 3 Dual SIM TD-LTE APAC X5516B📱
Title: “Introducing Our Latest Innovation: Specification of the Device”
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