Brand | Hisense |
Model | HS-F26 Dual SIM TD-LTE |
Released | 2017 Nov |
Announced | 2017 Nov 10 |
Hardware Designer | Hisense |
Manufacturer | Hisense |
General Extras | Haptic touch feedback |
Device Category | Smartphone |
Width | 76.1 mm |
Height | 158.94 mm |
Depth | 7.8 mm |
Dimensions | 3.00×6.26×0.31 inches |
Mass | 167 g |
Platform | Android |
Operating System | Google Android 7.1 (Nougat) |
Software Extras | Navigation software |
CPU Clock | 1400 MHz |
CPU | Qualcomm Snapdragon 425 MSM8917, 2016, 64 bit, quad-core, 512 Kbyte L2, 28 nm, Qualcomm Adreno 308 GPU |
RAM Type | LPDDR3 SDRAM |
RAM Capacity (converted) | 2 GiB RAM |
Non-volatile Memory Interface | eMMC 5.1 |
Non-volatile Memory Capacity (converted) | 16 GB ROM |
Display Diagonal | 152.14 mm |
Resolution | 720×1440 |
Horizontal Full Bezel Width | 8.06 mm |
Display Area Utilization | 76.5% |
Pixel Density | 269 PPI |
Display Type | Color IPS TFT LCD display |
Number of Display Scales | 16.8M |
Scratch Resistant Screen | No |
Graphical Controller | Qualcomm Adreno 308 |
Dedicated Graphics Memory | 0.125 MiB |
GPU Clock: | 500 MHz |
A/V Out | No |
Microphone(s) | mono |
Loudspeaker(s): | mono |
Audio Output: | 3.5mm |
Supported Cellular Bands | GSM850 , GSM900 , GSM1800 , GSM1900 , UMTS2100 (B1) , UMTS850 (B5) , UMTS900 (B8) , CDMA800 (BC0) , TD-SCDMA2000 , TD-SCDMA1900 , LTE2100 (B1) , LTE1800 (B3) , LTE850 (B5) , TD-LTE2600 (B38) , TD-LTE1900 (B39) , TD-LTE2300 (B40) , TD-LTE2500 (B41) bands |
Supported Cellular Data Links | GPRS , EDGE , UMTS , HSUPA , HSUPA 5.8 , HSDPA , HSDPA 7.2 , HSPA+ 21.1 , HSPA+ 42.2 , cdmaOne , CDMA2000 1x , CDMA2000 1xEV-DO , CDMA2000 1xEV-DO Rev A , TD-SCDMA , TD-HSDPA , LTE , LTE 50/25 , LTE 75/25 , LTE 100/50 , LTE 150/50 , LTE 300/50 data links |
SIM Card Slot | Nano-SIM (4FF) |
Complementary Phone Services | Voice transmission , Voice speaker , Vibrate , Speakerphone , VoLTE |
Dual Cellular Network Operation | Dual standby |
Sec. Supported Cellular Networks: | GSM900 , GSM1800 , GSM1900 |
Sec. Supported Cellular Data Links: | GPRS , EDGE |
Sec. SIM Card Slot | Nano-SIM (4FF) |
Touchscreen Type | Capacitive multi-touch screen |
Expansion Interfaces | TransFlash , microSD , microSDHC , microSDXC |
USB | USB 2.0 |
USB Services | USB charging |
USB Connector | USB Micro-B (Micro-USB) |
Bluetooth | Bluetooth 4.0 |
Wireless LAN | 802.11b , 802.11g , 802.11n |
Wireless Services | Wi-Fi Direct , Wi-Fi Tethering |
FM Radio Receiver | No |
Complementary Satellite Services | A-GPS , Geotagging , QuickGPS |
Supported GLONASS protocol(s) | L1OF |
Camera Placement | Rear |
Camera Image Sensor | CMOS |
Number of effective pixels | 13.0 MP camera |
Zoom | 1.0 x optical zoom |
Focus | CD AF |
Video Recording | 1920×1080 pixel |
Flash | single LED |
Camera Extra Functions | HDR photo , Touch focus , Macro mode , Panorama Photo , Face detection , Face tagging , Face retouch |
Aux. Camera Image Sensor | CMOS |
Aux. 2 Camera Image Sensor | No |
Aux. 3 Camera Image Sensor | No |
Aux. 4 Camera Image Sensor | No |
Secondary Camera Placement | Front |
Secondary Camera Sensor | CMOS |
Secondary Camera Number of pixels | 5.0 MP sec. cam |
Secondary Camera Extra Functions | Yes |
Sec. Aux. Cam. Image Sensor | No |
Built-in compass | Yes |
Built-in accelerometer | Yes |
Additional sensors | FP sensor , L sensor , P sensor |
Protection from solid materials | Yes |
Protection from liquids | Yes |
Battery | Li-ion |
Nominal Battery Capacity | 3020 mAh battery |
Talk Time: | 10.0 hours |
Market Countries | China |
Market Regions | Asia |
Mobile Operator | China Telecom Corporation Limited |
Added | 2024-06-23 |
Specifications data description of this 📱Hisense HS-F26 Dual SIM TD-LTE📱
Title: Specification of the Device: A Comprehensive Overview
Introduction
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In today’s technology-driven world, choosing the right device can be a daunting task. With a plethora of options available in the market, it is essential to have a comprehensive understanding of the specifications of the device before making a decision. In this blog post, we will provide an in-depth analysis of a device’s specifications, including its network, launch date, body, display, operating system, chipset, CPU, GPU, memory, camera, sound, communications, features, and battery.
Lineup
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Design
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Specifications
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Conclusion
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